B352F110T24

Specifications

Parameter	Values	Unit	Notes
+In to -In	-1.0 to 400	Vdc
+In to -In	500	Vdc	For 100 ms
PC to -In	-0.3 to 7.0	Vdc
+Out to -Out	-0.5 to 16.0	Vdc
solation voltage	4,242	Vdc	Input to Output
Output current	24.1	A	Continuous
Peak output current	32.7	A	For 1 ms
Output power	240	W	Continuous
Peak output power	360	W	For 1 ms
Case temperature	208	°C	During reflow
Operating junction temperature(1)	-40 to 125 -55 to 125	°C °C	T - Grade M - Grade
Storage temperature	-40 to 150 -65 to 150	°C °C	T - Grade M - Grade

Description

The V•I Chip Bus Converter Module (BCM) B352F110T24 is a high efficiency (>95%), narrow input range Sine Amplitude Converter (SAC) operating from a 330 to 365 Vdc primary bus to deliver an isolated low voltage secondary. The off-line BCM provides an isolated 10.3 -11.4 V distribution bus and is ideal for use in silver boxes and PFC front ends. Due to the fast response time and low noise of the B352F110T24, the need for limited life aluminum electrolytic or tantalum capacitors at the input of POL converters is reduced-or eliminated-resulting in savings of board area, materials and total system cost.

The BCM B352F110T24 achieves a power density of 876 W/in3 in a V•I Chip package compatible with standard pick-and-place and surface mount assembly processes. The V•I Chip package provides flexible thermal management through its low Junction-to-Case and Junction-to-Board thermal resistance. Owing to its high conversion efficiency and safe operating temperature range, the BCM B352F110T24 does not require a discrete heat sink in typical applications. Low junction to case and junction to lead thermal impedances assure low junction temperatures and long life in the harshest environments.