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MFG:ROHM Package Cooled:DIP

MFG:ROHM Package Cooled:DIP

|
Parameter |
Symbol |
Limits |
Unit | |
| Applied voltage |
VL |
16.5 |
V | |
| Power dissipation | BA6566 |
Pd |
1100*1 |
mW |
| BA6566F |
600*2 | |||
| BA6566FP |
1350*3 | |||
| Operating temperature |
Topr |
-35~+60 |
||
| Storage temperature |
Tstg |
-55~+150 |
||
| Current dissipation |
IL |
125*4 |
mA | |
1) Can accommodate both dynamic and piezoelectric receivers, simply by changing the circuit constant for a wide dynamic reception range.
2) Automatic gain control (AGC) is used, based on the transmission and reception telephone line current, for easier compliance with communications standards.
3) Erroneous operation caused by high-frequency electrical wave interference is minimized.
4) An HSOP package is used, eliminating the need for an attached transistor to dissipate heat. This means that a common circuit can be shared when a DIP package is used (BA6566FP).
BA6566
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