BCM2045

Features: • World's first Bluetooth 2.0 + EDR solution in 0.13 um CMOS technology• Fully integrated balun and T/R switch eliminates all external RF matching components• Supports class 1, 2, and 3 designs• Fully supports the Bluetooth 1.1, 1.2, and 2.0 standardsincluding 1, ...

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SeekIC No. : 004297522 Detail

BCM2045: Features: • World's first Bluetooth 2.0 + EDR solution in 0.13 um CMOS technology• Fully integrated balun and T/R switch eliminates all external RF matching components• Supports cl...

floor Price/Ceiling Price

Part Number:
BCM2045
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/30

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Product Details

Description



Features:

• World's first Bluetooth 2.0 + EDR solution in 0.13 um CMOS technology
• Fully integrated balun and T/R switch eliminates all external RF matching components
• Supports class 1, 2, and 3 designs
• Fully supports the Bluetooth 1.1, 1.2, and 2.0 standards
including 1, 2, and 3 Mbps EDR operation
• Lowest current consumption in all modes of operation
• ROM-based solution eliminates external flash and/or EEPROM memory
• Highest available Bluetooth radio performance of any singlechip solution
• 88 dBm receiver sensitivity using EDR communication
• Programmable output power up to +7 dBm
• Minimized external BOM requirements are less than 10
external passive components
• Supports UART, USB, SDI, and SPI HCI transports
• Fractional-N frequency synthesizer supports any crystal or
TCXO source from 12 to 40 MHz
• Automatic calibration and frequency detection of crystal frequency





Application

• Cellular and mobile communication devices
• PDA and low-power embedded communication devices
• PC and integration on PC mother board applications
• Package types available
95-pin fpBGA package (6 mm x 6 mm)
65-pin fpBGA package (5 mm x 5 mm)
Wafer scale flip chip packaging





Description

The Blutonium® BCM2045 is the next generation of Broadcom's leading line of single-chip solutions for Bluetooth applications, designed from the ground-up to promote and enable the adoption of Bluetooth in phones, computers, peripherals and other devices. The BCM2045 chip addresses every major challenge confronting equipment manufacturers when adopting Bluetooth wireless technology, including power consumption, board space, radio performance and cost. Designed in the 0.13 micron manufacturing process, the BCM2045 can provide advantages in all these areas that are unmatched by competing devices made with older technologies.

In addition to best-in-class power and performance, the BCM2045 also features the highest level of integration in the industry, including on-chip balun, resulting in an approximately 50% lower OEM/ODM external bill of materials and significantly smaller printed circuit board space utilization versus competing Bluetooth solutions. The BCM2045 chip also supports the new Bluetooth Extended Data Rate (EDR), providing raw bandwidth of 3 Megabits per second for wireless applications. In addition, Broadcom's InConcert® interference avoidance technology reduces possible disruption from nearby Wi-Fi® products, which operate in the same 2.4 GHz radio frequency as Bluetooth.




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