HEATSINK CPU W/ADHESIVE 1.01"SQ
BDN10-3CB/A01: HEATSINK CPU W/ADHESIVE 1.01"SQ
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| Capacitance : | 16.5 pF | Series: | BDN |
| Manufacturer: | CTS Thermal Management Products | Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) | Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square, Pin Fins | Length: | 1.01" (25.65mm) |
| Width: | 1.010" (25.65mm) | Diameter: | - |
| Height Off Base (Height of Fin): | 0.355" (9.02mm) | Power Dissipation @ Temperature Rise: | - |
| Thermal Resistance @ Forced Air Flow: | 8.0°C/W @ 400 LFM | Thermal Resistance @ Natural: | 26.4°C/W |
| Material: | Aluminum |
| Technical/Catalog Information | BDN10-3CB/A01 |
| Vendor | CTS Thermal Management Products |
| Category | Fans, Thermal Management |
| Attachment Method | Thermal Tape, Adhesive (Included) |
| Height | 0.35" (9mm) |
| Material | Aluminum |
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
| Power Dissipation @ Temperature Rise | - |
| Thermal Resistance @ Forced Air Flow | 8.0°C/W @ 400 LFM |
| Outline | 25.65mm x 25.65mm |
| Thermal Resistance @ Natural | 26.4°C/W |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | BDN10 3CB A01 BDN103CBA01 294 1098 ND 2941098ND 294-1098 |