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MFG:INFINEON Package Cooled:SOT343 D/C:2007
- Table of contents:
BGA425
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Suppliers
DataSheet
General Description
BGA425 Maximum Ratings
| Parameter | Symbol | Value | Unit |
| Device current | ID | 25 | mA |
| Device voltage | VD,+V | 6 | |
| Total power dissipation, TS tbd °C | Ptot | 150 | mW |
| RF input power | PRFin | -10 | dBm |
| Junction temperature | Tj | 150 | |
| Ambient temperature | TA | -65 ...+150 | |
| Storage temperature | Tstg | -65 ...+150 | |
| Thermal Resistance | |||
| Junction - soldering point 1) | RthJS | tbd | K/W |
1) TS is measured on the ground lead at the soldering point to the pcb
BGA425 Features
• Multifunctional casc. 50 Ω block (LNA / MIX)
• Unconditionally stable
• Gain |S21|2 = 18.5 dB at 1.8 GHz (appl.1)
gain |S21|2 = 22 dB at 1.8 GHz (appl.2)
IP3out = +7 dBm at 1.8 GHz (VD=3V,ID=9.5mA)
• Noise figure NF = 2.2 dB at 1.8 GHz
• Reverse isolation >28 dB (appl.1) >35 dB (appl.2)
• typical device voltage VD = 2 V to 5 V
Tape loading orientation
• Unconditionally stable
• Gain |S21|2 = 18.5 dB at 1.8 GHz (appl.1)
gain |S21|2 = 22 dB at 1.8 GHz (appl.2)
IP3out = +7 dBm at 1.8 GHz (VD=3V,ID=9.5mA)
• Noise figure NF = 2.2 dB at 1.8 GHz
• Reverse isolation >28 dB (appl.1) >35 dB (appl.2)
• typical device voltage VD = 2 V to 5 V
Tape loading orientation
BGA425
PDF/DataSheet Download
- Datasheet: BGA425
- File Size: 83581 KB
- Manufacturer: SIEMENS [Siemens Semiconductor Group]
- Click here to Download
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