BPV1152-1030-34AB95L

The sockets this document applies to are as follows: Clam Shell, Knob Lock, Screw Lock, Twist Lock, Quick Lock and Lever Lock in SMD style. These sockets utilize the E-tec patented springpin technology. This technology allows the pins to be soldered to the PCB while still providing compliance to the device under test (DUT) via springs located at the other end of the pin. The pins themselves do not have solder pre-forms as a BGA would with its solder balls. However, the sockets are designed to mount to the same PCB footprint and pads as required by the BGA, or any other IC package the socket was designed for (except if locating pegs are used; see 'Locating Pegs' section of this document). When compared to mounting a BGA, an extra volume of solder paste is required to mount the sockets to the PCB. To effect this, a properly dimensioned stencil is required. Once the paste has been applied, a standard reflow process is then used to solder the socket to the PCB. After the socket is verified to have proper electrical connection to the PCB, the system is then ready to be used.