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Part Number: BSBU-400-1C

 

 

 

 

 

Urgent Purchase

BSBU-400-1C Features

·VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: ·Typical < 2%, Max. < 10% of Die Area)
·BUILT-IN STRESS RELIEF MECHANISM FOR
·SUPERIOR RELIABILITY AND PERFORMANCE
·SURGE OVERLOAD RATING TO 200 AMPS PEAK
·IDEAL FOR PRINTED CIRCUIT BOARD APPLICATIONS

BSBU-400-1C datasheet


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