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BSM244F

Features: ·Power module·Half-bridge·FREDFET·N channel·Enhancement mode·Package with insulated metal base plate·Package outline/Circuit diagram: 2a1)Specifications Parameter Symbol Values Unit Drain-source voltage VDS 400 V Drain-gate voltage, RGS = 20 kW VDGR 400 Gate-source ...

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SeekIC No. : 004302187 Detail

BSM244F: Features: ·Power module·Half-bridge·FREDFET·N channel·Enhancement mode·Package with insulated metal base plate·Package outline/Circuit diagram: 2a1)Specifications Parameter Symbol Values Uni...

BSM244F Data Sheet

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Part Number:
BSM244F
Supply Ability:
5000

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  • 1~5000
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  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/22

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Product Details

Description



Features:

·Power module
·Half-bridge
·FREDFET
·N channel
·Enhancement mode
·Package with insulated metal base plate
·Package outline/Circuit diagram: 2a1)


Specifications

Parameter Symbol Values Unit
Drain-source voltage VDS 400 V
Drain-gate voltage, RGS = 20 kW VDGR 400
Gate-source voltage VGS ± 20
Continuous drain current, TC = 25 ID 45 A
Pulsed drain current, TC = 25 ID puls 180
Operating and storage temperature range Tj, Tstg 55 . + 150
Power dissipation, TC = 25 Ptot 400 W
Thermal resistance
Chip-case		 Rth JC 0.31 K/W
Insulation test voltage2), t = 1 min. Vis 2500 Vac
Creepage distance, drain-source - 16 mm
Clearance, drain-source - 11
DIN humidity category, DIN 40 040 - F -
IEC climatic category, DIN IEC 68-1 - 55/150/56
1) See chapter Package Outline and Circuit Diagrams.
2) Insulation test voltage between drain and base plate referred to standard climate 23/50 in acc. with DIN 50 014, IEC 146, para. 492.1.


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