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MFG:PHILIPS  Package Cooled:SOT223  D/C:09+  

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BSP Series Datasheet download

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Part Number: BSP250

 

MFG: PHILIPS

Package Cooled: SOT223

D/C: 09+

Description: ·P-channel enhancement mode vertical D-MOS transistor in a SOT223 plastic SMD package.


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BSP250 General Description


·P-channel enhancement mode vertical D-MOS transistor in a SOT223 plastic SMD package.

BSP250 Maximum Ratings

SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VDS
drain-source voltage
-30
V
VGSO
gate-source voltage
open drain
±20
V
ID
DC drain current
Ts 100 °C
-3
mA
IDM
peak drain current
note 1
-12
A
Ptot
total power dissipation
Ts = 100 °C
5
W
Tamb = 25 °C; note 2
1.65
Tstg
storage temperature
-65
+150
°C
Tj
operating junction temperature
150
°C

Notes
1. Pulse width and duty cycle limited by maximum junction temperature.
2. Device mounted on an epoxy printed-circuit board, 40 X40 X1.5 mm; mounting pad for drain lead minimum 6 cm 2.

BSP250 Features

· High-speed switching
· No secondary breakdown
· Very low on-resistance.

BSP250 Typical Application

· Low-loss motor and actuator drivers
· Power switching.

BSP250 datasheet

BSP250
PDF/DataSheet Download

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