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BYG50M

Features: * Glass passivated* High maximum operating temperature* Low leakage current* Excellent stability* Guaranteed avalanche energy absorption capability* UL 94V-O classified plastic package* Shipped in 12 mm embossed tape.PinoutSpecifications SYMBOL PARAMETER CONDITIONS MIN. MAX. UN...

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SeekIC No. : 004305547 Detail

BYG50M: Features: * Glass passivated* High maximum operating temperature* Low leakage current* Excellent stability* Guaranteed avalanche energy absorption capability* UL 94V-O classified plastic package* Sh...

BYG50M Data Sheet

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Part Number:
BYG50M
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/29

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Product Details

Description



Features:

* Glass passivated
* High maximum operating temperature
* Low leakage current
* Excellent stability
* Guaranteed avalanche energy absorption capability
* UL 94V-O classified plastic package
* Shipped in 12 mm embossed tape.


Pinout

Connection Diagram


Specifications

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VRRM repetitive peak reverse voltage 1000 V
VR continuous reverse voltage 1000  V
I F(AV) average forward current averaged over any 20 ms
period; Ttp = 100 °C; see Fig.2
averaged over any 20 ms
period; Al2O3 PCB mounting (see
Fig.7); Tamb =60 °C; see Fig.3
averaged over any 20 ms
period; epoxy PCB mounting
(see Fig.7); Tamb =60 °C;
see Fig.3

2.1



1.0



0.7


 A
IFSM non-repetitive peak forward current t = 10 ms half sinewave;
Tj =Tj max prior to surge;
VR =VRRMmax
 30
 A
E RSM non-repetitive peak reverse avalanche energy L = 120 mH; Tj =Tj max prior to surge; inductive load switched off 7 mJ
Tstg storage temperature -65 +175
Tj operating junction temperature -65 +175



Description

DO-214AC; SOD106 surface mountable package with glass passivated chip.The well-defined void-free case of BYG50M is of a transfer-moulded thermo-setting plastic.


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