Features: · Glass passivated· High maximum operating temperature· Low leakage current· Excellent stability· Guaranteed avalanche energy absorption capability· UL 94V-O classified plastic package· Shipped in 12 mm embossed tape.ApplicationThese products are not designed for use in life support appl...
BYG70: Features: · Glass passivated· High maximum operating temperature· Low leakage current· Excellent stability· Guaranteed avalanche energy absorption capability· UL 94V-O classified plastic package· Sh...
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These products are not designed for use in life support appliances, devices, or systems where malfunction of theseproducts can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
SYMBOL | PARAMETER | CONDITIONS | MIN. | MAX. | UNIT |
VRRM | repetitive peak reverse voltage BYG70D BYG70G BYG70J |
- - - |
200 400 600 |
V V V | |
VR |
continuous reverse voltage BYG70D BYG70G BYG70J |
- - - |
200 400 600 |
V V V | |
IF(AV) | average forward current | averaged over any 20 ms period; Ttp = 100 °C; see Fig.2 |
- | 1.00 | A |
averaged over any 20 ms period; Al2O3 PCB mounting (see Fig.7); Tamb = 60 °C; see Fig.3 |
- | 0.53 | A | ||
averaged over any 20 ms period; epoxy PCB mounting (see Fig.7); Tamb = 60 °C; see Fig.3 |
- | 0.39 | A | ||
IFSM | non-repetitive peak forward current |
t = 10 ms half sine wave; Tj = Tj max prior to surge; VR = VRRMmax |
- | 20 | A |
ERSM | non-repetitive peak reverse avalanche energy |
L = 120 mH; Tj = Tj max prior to surge; inductive load switched off |
- | 10 | mJ |
Tstg | storage temperature | -65 | +175 | °C | |
Tj | junction temperature | see Fig.4 | -65 | +175 | °C |
DO-214AC surface mountable package BYG70 with glass passivated chip.
The well-defined void-free case of BYG70 is of a transfer-moulded thermo-setting plastic.