Features: · Glass passivated· High maximum operating temperature· Low leakage current· Excellent stability· Guaranteed avalanche energy absorption capability· UL 94V-O classified plastic package· Shipped in 12 mm embossed tape.Specifications SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT ...
BYG80: Features: · Glass passivated· High maximum operating temperature· Low leakage current· Excellent stability· Guaranteed avalanche energy absorption capability· UL 94V-O classified plastic package· Sh...
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SYMBOL | PARAMETER | CONDITIONS | MIN. | MAX. | UNIT |
VRRM | repetitive peak reverse voltage BYG80A BYG80B BYG80C BYG80D BYG80F BYG80G BYG80J |
- - - - - - - - |
50 100 150 200 250 300 400 600 |
V V V V V V V V | |
VR | continuous reverse voltage BYG80A BYG80B BYG80C BYG80D BYG80F BYG80G BYG80J |
- - - - - - - - |
50 100 150 200 250 300 400 600 |
V V V V V V V V | |
IF(AV) | average forward current BYG80A to D BYG80F; BYG80G BYG80J |
Ttp = 100 °C; see Figs 2, 3 and 4 averaged over any 20 ms period; see also Figs 17, 18 and 19 |
- - - |
2.4 2.3 2.0 |
A A A |
IF(AV) | average forward current BYG80A to D BYG80F; BYG80G BYG80J |
Tamb = 60 °C; AL2O3 PCB mounting (see Fig.27); see Figs 5, 6 and 7 averaged over any 20 ms period; see also Figs 17, 18 and 19 |
- - - |
1.25 1.15 0.95 |
A A A |
DO-214AC surface mountable package with glass passivated chip.
The well-defined void-free case of BYG80 is of a transfer-moulded thermo-setting plastic.