BYG80

Features: · Glass passivated· High maximum operating temperature· Low leakage current· Excellent stability· Guaranteed avalanche energy absorption capability· UL 94V-O classified plastic package· Shipped in 12 mm embossed tape.Specifications SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT ...

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BYG80 Picture
SeekIC No. : 004305558 Detail

BYG80: Features: · Glass passivated· High maximum operating temperature· Low leakage current· Excellent stability· Guaranteed avalanche energy absorption capability· UL 94V-O classified plastic package· Sh...

floor Price/Ceiling Price

Part Number:
BYG80
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/29

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Product Details

Description



Features:

· Glass passivated
· High maximum operating temperature
· Low leakage current
· Excellent stability
· Guaranteed avalanche energy absorption capability
· UL 94V-O classified plastic package
· Shipped in 12 mm embossed tape.



Specifications

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VRRM repetitive peak reverse voltage
BYG80A
BYG80B
BYG80C
BYG80D
BYG80F
BYG80G
BYG80J
  -
-
-
-
-
-
-
-
50
100
150
200
250
300
400
600
V
V
V
V
V
V
V
V
VR continuous reverse voltage
BYG80A
BYG80B
BYG80C
BYG80D
BYG80F
BYG80G
BYG80J
  -
-
-
-
-
-
-
-
50
100
150
200
250
300
400
600
V
V
V
V
V
V
V
V
IF(AV) average forward current
BYG80A to D
BYG80F; BYG80G
BYG80J
Ttp = 100 °C; see Figs 2, 3 and 4
averaged over any 20 ms period;
see also Figs 17, 18 and 19
-
-
-
2.4
2.3
2.0
A
A
A
IF(AV) average forward current
BYG80A to D
BYG80F; BYG80G
BYG80J
Tamb = 60 °C; AL2O3 PCB mounting
(see Fig.27); see Figs 5, 6 and 7
averaged over any 20 ms period;
see also Figs 17, 18 and 19
-
-
-
1.25
1.15
0.95
A
A
A



Description

DO-214AC surface mountable package with glass passivated chip.

The well-defined void-free case of BYG80 is of a transfer-moulded thermo-setting plastic.




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