MFG:PHILIPS Package Cooled:SOD57 D/C:09+
MFG: PHILIPS
Package Cooled: SOD57
D/C: 09+
Description: Rugged glass SOD57 package, using a high temperature alloyed construction. This packag...
| SYMBOL | PARAMETER | CONDITIONS | MIN. | MAX. | UNIT |
| VRRM | repetitive peak reverse voltage | 400 | V | ||
| VR | continuous reverse voltage | 400 | V | ||
| I F(AV) | average forward current | Ttp =85 °C; lead length = 10 mm; see Figs 2 and 3; averaged over any 20 ms period;see also Figs 10 and 11 Tamb =60 °C; PCB mounting (see Fig.19); see Figs 4 and 5;averaged over any 20 ms period;see also Figs 10 and 11 |
1.00 |
A | |
| IFRM | repetitive peak forward current | Ttp =85 °C; see Figs 6 and 7 | 10.0 | A | |
| IFRM | repetitive peak forward current | Tamb =60 °C;see Figs 8 and 9 |
6.0 |
A | |
| IFSM | non-repetitive peak forward current | t = 10 ms half sinewave; Tj =Tj max prior to surge; VR =VRRMmax |
30 |
A |
| E RSM | non-repetitive peak reverse avalanche energy | L = 120 mH; Tj =Tj max prior to surge; inductive load switched off | 10 | mJ | |
| Tstg | storage temperature | -65 | +175 | ||
| Tj | operating junction temperature | -65 | +175 |
BYV26B
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Rugged glass SOD57 package, BYV26A is using a high temperature alloyed construction. BYV26A is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
Rugged glass SOD57 package,BYV26 isusing a high temperature alloyed construction.BYV26 is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
DIODE RECT 600V 5A TO-220F
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