C2955

Features:

Best suited for flip-chip evaluation
No damage to part under observation
High sensitivity, high resolution
Built-in contrast enhancement function
Shading correction function


Application

· Inspection of flip-chip and other packaged IC devices
· Testing for abnormalities (defects, failures) in metal and polysilicon wiring
· Observation of wire bonding
· Observation of various types of die bonding zones
· Simultaneous inspection of Al-Si nodules and multiple patterns
· Observation of pattern diffusion into substrate
· Identification of ESD failure locations


Description

The C2955 is an IC internal inspection system incorporating an infrared microscope and an infrared CCD camera. Use of a newly developed infrared CCD camera enables a high sensitivity approximately ten times that of conventional systems (in comparisons by HAMAMATSU), at a wavelength of 1.0 m, making C2955 possible to obtain sharp, clear images with high resolution. Using an infrared light which is transmitted through the silicon substrate enables observation of the interconnect lines in the IC, the wire bonding status, and the die bonding conditions, along with the diffusion zone conditions, without damaging the part under observation. Observation can be done from the back side, when the sample is prepared by scraping away the molding on the side opposite the surface of the silicon substrate. Because the metal wiring is never touched in the inspection process, precise testing can be carried out under optimum conditions, making C2955 possible to inspect the condition of the diffusion zones, the multilayer interconnect lines, the Al-Si nodules wire bonding interfaces, and die bonding details.