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C850-6

Features: • One component• Silver filled• Low viscosityApplicationAMICON C 850-6 is designed for bonding most plastic packaged ICs and other die attach applications.DescriptionAMICON C 850-6 is a fast curing, one component, low viscosity, silver filled epoxy die attach adhesive. ...

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SeekIC No. : 004310093 Detail

C850-6: Features: • One component• Silver filled• Low viscosityApplicationAMICON C 850-6 is designed for bonding most plastic packaged ICs and other die attach applications.DescriptionAMIC...

C850-6 Data Sheet

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Part Number:
C850-6
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/27

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Product Details

Description



Features:

• One component
• Silver filled
• Low viscosity


Application

AMICON C 850-6 is designed for bonding most plastic packaged ICs and other die attach applications.


Description

AMICON C 850-6 is a fast curing, one component, low viscosity, silver filled epoxy die attach adhesive. It features high electrical and thermal conductivity and high strength at wire bond temperatures. AMICON C 850-6 also features a low viscosity to avoid tailing, stringing and dry out problems in high speed die attach equipment.




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