CD54AC540

DescriptionThe CD54AC540 is a kind of octal buffer/line driver with the RCA ADVANCED CMOS technology. CD54AC540 is an inverting 3-state buffer with two active-LOW output enables. It is available in chip form (H-suffix) and operable over the -55 to +125 temperature range. There are some features o...

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SeekIC No. : 004311544 Detail

CD54AC540: DescriptionThe CD54AC540 is a kind of octal buffer/line driver with the RCA ADVANCED CMOS technology. CD54AC540 is an inverting 3-state buffer with two active-LOW output enables. It is available in ...

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Part Number:
CD54AC540
Supply Ability:
5000

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  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/30

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Product Details

Description



Description

The CD54AC540 is a kind of octal buffer/line driver with the RCA ADVANCED CMOS technology. CD54AC540 is an inverting 3-state buffer with two active-LOW output enables. It is available in chip form (H-suffix) and operable over the -55 to +125 temperature range.

There are some features of CD54AC540 as follows: (1)exceeds 2-kV ESD protection-MIL-STD-883 method 3015; (2)SCR-Latchup-resistant CMOS process and circuit design; (3)CD54AC540 speed of bipolar FAST/AS/S with significantly reduced power consumption; (4)balanced propagation delays; (5)1.5 V to 5.5 V operation and balanced noise immunity at 30% of the supply; (6)±24 mA output drive current: fanout to 15 FAST ICs and drives 50 ohm transmission lines.

The following is CD54AC540 absolute maximum ratings: (1)DC supply voltage, VCC: -0.5 to 6 V; (2)DC input diode current, IIK (for VI<-0.5 V or VI>VCC+0.5 V): ±20 mA; (3)CD54AC540 DC output diode current, IOK (for VO<-0.5 V or VO>VCC+0.5 V): ±50 mA; (4)DC output source or sink current per output pin, IO (for VO<-0.5 V or VO>VCC+0.5 V): ±50 mA; (5)DC VCC or ground current (ICC or IGND): ±100 mA; (6)operating temperature range (TA): -55 to +125; (7)storage temperature range (Tstg): -65 to +150; (8)CD54AC540 lead temperature (during soldering): +265 at distance 1/16±1/32 inch from case for 10s max and +300 for unit inserted into PC board min. thicknes 1/16 inch with solder contacting lead tips only.




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