CM1414

• Functionally and pin compatible with CMD&primes CSPEMI204
• OptiGuard™ coated for improved reliability at assembly
• Two channels of EMI filtering, one for a microphone and one for an earpiece speaker
• Pi-style EMI filters in a capacitor-resistor-capacitor (C-R-C) network
• Greater than 35dB attenuation in the 800-2700MHz range
• ±8kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge)
• ±15kV ESD protection on each channel (HBM)
• Chip Scale Package features extremely low parasitic inductance for optimum filter performance
• 5-bump, 0.950mm X 1.41mm footprint Chip Scale Package (CSP)
• Lead-free version available

The CM1414 is a low-pass filter array designed specifically to reduce EMI/RFI emissions and provide ESD protection for a headset port on cellular and mobile devices. The CM1414 integrates two high quality, pi-style filters (C-R-C) filters, one for a microphone and one for an earpiece or speaker, each providing more than 35dB attenuation relative to the pass band attenuation in the 800-2700 MHz range. These filters support bidirectional filtering, reducing EMI both to and from the headset port and support bipolar audio signals without distortion.

In addition, the CM1414 provides a very high level of protection for sensitive electronic components that may be subject to electrostatic discharge (ESD). The input pins are designed and characterized to safely dissipate ESD strikes of ±8kV contact discharge, the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than ±15kV. The CM1414 protects sensitive components such as CPU and DSPs that have much weaker internal ESD protection circuitry usually only intended for mechanical handling protection.

The CM1414 is particularly well suited for portable electronics because of its small package format and low weight. The CM1414 incorporates OptiGuard™ coating which results in improved reliability at assembly and is available in a space-saving, low-profile Chip Scale Package with optional lead-free finishing.

Note: Some of the devices listed here have suggested replacements available. Please see additional information at the end of this page.