CM1440

• Six channels of EMI filtering for data ports
• Pi-style EMI filters in a capacitor-resistor-capacitor (C-R-C) network
• ±30kV ESD protection on each channel(IEC 61000-4-2 Level 4, contact discharge)
• ±30kV ESD protection on each channel (HBM)
• Greater than 35dB attenuation (typical) at 1 GHz
• 15-bump, 0.4mm pitch, 2.360mm x 1.053mm footprint Chip Scale Package (CSP)
• Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance
• Optiguard™ coated for improved reliability at assembly
• RoHS compliant (lead-free) finishing

The CM1440 is a six channel low-pass EMI filter array with ESD protection that reduces EMI/RFI emissions while providing robust protection from ESD strikes. Each EMI filter channel integrates a high quality pi-style filter (30pF-100-30pF) which provides greater than 30dB of attenuation in the 800MHz to 2.7GHz frequency range. The parts include avalanche-type ESD diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD protection diodes connected to the filter ports safely dissipate ESD strikes of ±30kV, beyond the maximum requirement of the IEC61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±30kV.

CM1440 is particularly well-suited for portable electronics (e.g. wireless handsets, PDAs, notebook computers) because of its small package and easy-to-use pin assignments. In particular, the CM1440 is ideal for EMI filtering and protecting data and control lines for the I/O data ports, LCD display and camera interface in mobile handsets.

The CM1440 incorporates Optiguard™ which results in improved reliability at assembly. The CM1440 is available in a space saving, low profile Chip Scale Package with RoHS compliant lead-free finishing. It is manufactured with a 0.40mm pitch and 0.25mm CSP solder ball to provide up to 28% board space savings versus competing CSP devices with 0.50mm pitch and 0.30mm CSP solder ball.