CM30TF-12H

IGBT MOD 6PAC 600V 30A H SER

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CM30TF-12H Picture
SeekIC No. : 004131119 Detail

CM30TF-12H: IGBT MOD 6PAC 600V 30A H SER

floor Price/Ceiling Price

Part Number:
CM30TF-12H
Mfg:
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/28

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Product Details

Quick Details

Series: IGBTMOD™ Manufacturer: Powerex Inc
IGBT Type: - Configuration: Three Phase Inverter
Voltage - Collector Emitter Breakdown (Max): 600V Vce(on) (Max) @ Vge, Ic: 2.8V @ 15V, 30A
Current - Collector (Ic) (Max): 30A Interface Type : I2S, USB
Current - Collector Cutoff (Max): 1mA Input Capacitance (Cies) @ Vce: 3nF @ 10V
Power - Max: 150W Input: Standard
NTC Thermistor: No Mounting Type: Chassis Mount
Package / Case: Module    

Description

Voltage - Collector Emitter Breakdown (Max): 600V
Input: Standard
NTC Thermistor: No
Mounting Type: Chassis Mount
IGBT Type: -
Series: IGBTMOD™
Manufacturer: Powerex Inc
Current - Collector Cutoff (Max): 1mA
Package / Case: Module
Supplier Device Package: Module
Configuration: Three Phase Inverter
Vce(on) (Max) @ Vge, Ic: 2.8V @ 15V, 30A
Current - Collector (Ic) (Max): 30A
Input Capacitance (Cies) @ Vce: 3nF @ 10V
Power - Max: 150W


Application

AC Motor Control
Motion/Servo Control
UPS
Welding Power Supplies
Laser Power Supplies



Specifications

Ratings Symbol CM400HA-34H Units
Junction Temperature Tj -40 to 150 °C
Storage Temperature Tstg -40 to 125 °C
Collector-Emitter Voltage (G-E SHORT) VCES 600 Volts
Gate-Emitter Voltage VCES ±20 Volts
Collector Current IC 30 Amperes
Peak Collector Current ICM 60* Amperes
Diode Forward Current IF 30 Amperes
Diode Forward Surge Current IFM 60* Amperes
Power Dissipation Pd 150 Watts
Mounting Torque, M5 Terminal Screws - 17 in-lb
Module Weight (Typical) - 260 Grams
V Isolation VRMS 2500 Volts



Description

Powerex IGBTMOD™ Modules CM30TF-12H are designed for use in switching applications. Each module consists of six IGBT Transistors in a three phase bridge configuration, with each transistor having a reverse- connected super-fast recovery free-wheel diode. All components and interconnects are isolated from the heat sinking baseplate, offering simplified system assem- bly and thermal management.




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