Features: • Housed in a surface mount package alternative to mini-flat package of 1.27 mm pitch• Double molded package• 2.5 kV isolation voltage• UL approved (File No. E79920)Application• Suited for interface circuits requiring high density mounting of parts, especial...
CNC1H001: Features: • Housed in a surface mount package alternative to mini-flat package of 1.27 mm pitch• Double molded package• 2.5 kV isolation voltage• UL approved (File No. E79920...
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• Housed in a surface mount package alternative to mini-flat package of 1.27 mm pitch
• Double molded package
• 2.5 kV isolation voltage
• UL approved (File No. E79920)
• Suited for interface circuits requiring high density mounting of parts, especially hybrid ICs and programmable controllers
• Signal transfer between circuits with different potentials and with impedances
| Parameter | Symbol | Rating | Unit | |
| Input (light emitting diode) |
Reverse voltage (DC) | VR | 6 | V |
| Forward current (DC) | IF | 50 | mA | |
| Pulse forward current *1 |
IFP | 1 | A | |
| Power dissipation *2 | PD | 75 | mW/ch | |
| Output (photo transistor) |
Collector current | IC | 50 | mA |
| Collector-emitter voltage | VCEO | 80 | V | |
| Emitter-collector voltage |
VECO | 7 | V | |
| Collector power dissipation *3 | PC | 120 | mW/ch | |
| Isolation voltage, input to output *4 | VISO | 2500 | V[rms] | |
| Operating ambient temperature | Topr | −30 to +100 | °C | |
| Storage temperature | Tstg | −55 to +125 | °C | |