DescriptionThe CPC1908 is one of i4-PAC™ Power Relay.Clare and IXYS bring OptoMOS® technology, reliability and compact size to a new family of high power solid state relays. The CPC1908 is a part of that family,and it is normally open (1-Form-A) Solid State Power Relay is rated for up to...
CPC1908: DescriptionThe CPC1908 is one of i4-PAC™ Power Relay.Clare and IXYS bring OptoMOS® technology, reliability and compact size to a new family of high power solid state relays. The CPC1908 is...
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The CPC1908 is one of i4-PAC™ Power Relay.
Clare and IXYS bring OptoMOS® technology, reliability and compact size to a new family of high power solid state relays. The CPC1908 is a part of that family,and it is normally open (1-Form-A) Solid State Power Relay is rated for up to 8.5Arms continuous load current with a 5°C/W heat sink. The CPC1908 uses optically coupled MOSFET technology to provide 2500Vrms of input to output isolation.The unique i4-PAC package which is pioneered by IXYS allows Solid State Relays to achieve the highest load current and power ratings
There are twelve Applications of the CPC1908.The first of all is that it has Industrial Controls.The second is that it has Motor Control.The third is that it has Robotics.The forth is that it has Medical Equipment-Patient/Equipment Isolation.The fifth is that it has Instrumentation,including Multiplexers,Data Acquisitio, Electronic Switching,I/O Subsystems,and Meters (Watt-Hour, Water, Gas).The fifth is that it has IC Equipment.The seventh is that it has Home Appliances.
There are nine Features of the CPC1908.The first of all is that it has Compact i4-PAC™ Power Package.The second is that it has Low Thermal Resistance (0.35 °C/W).The third is that it has 8.5Arms Load Current with 5°C/W Heat Sink.The forth is that it has Electrically Non-conductive Thermal Pad for Heat Sink Applications.The fifth is that it has Low Drive Power Requirements.The sixth is that it has Arc-Free With No Snubbing Circuits.The seventh is that it has 2500Vrms Input/Output Isolation.The eighth is that it has No EMI/RFI Generation.The ninth is that it has Machine Insertable, Wave Solderable.