CSPRC032

Features:

• Minimal Cross-Talk
• 4 Filter lines per device
• Ultra small foot print
• Silicon substrate
• 0.35mm Eutectic Solder Bumps


Application

• Cellular Phones
• Cordless Phones
• Internet Appliances
• PDAs
• Laptop Computers


Description

Many portable applications frequently demand filtering of signals in the 800-2,700 MHz band. California Micro Devices' CSPRC032 unique thin film Flip Chip filters provide a minimum of 30 dB of attenuation over this frequency band.

The bump size and pitch of these filters are selected such that CSPRC032 can be placed directly on a FR4 printed circuit board using conventional assembly techniques. The pin-out for CSPRC032 features a signal 'flow through' design, allowing optimal signal routing. Ground-bounce and cross-talk are minimized via a die design that provides two solder bump contacts to the common supply connection.

The solder bump CSPRC032 contacts are a 63/37 Sn/Pb alloy and are nominally 0.35 mm in diameter.