CX20460

Features: • Power on/off control• Generation of system voltages from a single power source• Eight regulators• Built-in linear battery charger• Analog multiplexer• Generation of system power on reset• Overcurrent limiting• Step-up DC/DC converter̶...

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SeekIC No. : 004317916 Detail

CX20460: Features: • Power on/off control• Generation of system voltages from a single power source• Eight regulators• Built-in linear battery charger• Analog multiplexer•...

floor Price/Ceiling Price

Part Number:
CX20460
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/26

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Product Details

Description



Features:

• Power on/off control
• Generation of system voltages from a single power source
• Eight regulators
• Built-in linear battery charger
• Analog multiplexer
• Generation of system power on reset
• Overcurrent limiting
• Step-up DC/DC converter
• 48-pin LGA 7.0x7.0 mm package
• 3 V and 5 V Subscriber Identity Module (SIM) support including level shifting



Description

Skyworks Power Management Integrated Circuit (PMIC) integrates all the power supply and battery charging functions of a low power wireless system into one package. The device is designed for Global System for Mobile communications (GSM) and General Packet Radio Service (GPRS) cellular handset applications. The CX20460 PMIC is easily programmable using a two-wire serial interface to ensure maximum flexibility for a wide variety of designs.

CX20460 provides the following functions:
• Voltage switching, conversion, and regulation
• Power management control logic
• Charging and monitoring of system battery
• SIM interface

CX20460 is packaged in a 48-pin 7.0 x 7.0 mm Land Grid Array (LGA). The LGA includes a downset paddle, which should be connected to the board ground plane.
• CX20460-11 with a 1.20 mm chip height (For previous designs).
• CX20460-12 with a 1.00 mm chip height
• CX20460-32 with a 1.00 mm chip height

The CX20460 PMIC block diagram is shown in Figure 1. The device package is shown in Figure 2 through Figure 4.




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