Position: Home  > All Categories> Integrated Circuits (ICs) > CxxxXR230-Sxx00-A

CxxxXR230-Sxx00-A

Features: ` XT Rectangular LED Performance` 460 nm & 470 nm` XR-18™ 18.0 mW min.` XR-21™ 21.0 mW min.` Thin 150 m Chip` Low Forward Voltage 3.2 Typical at 20 mA` Single Wire Bond Structure` Class 2 ESD RatingApplicationMobile Appliance LCD BacklightingDigital Camera FlashSpecifi...

product image

CxxxXR230-Sxx00-A Picture
See larger image
SeekIC No. : 004319093 Detail

CxxxXR230-Sxx00-A: Features: ` XT Rectangular LED Performance` 460 nm & 470 nm` XR-18™ 18.0 mW min.` XR-21™ 21.0 mW min.` Thin 150 m Chip` Low Forward Voltage 3.2 Typical at 20 mA` Single Wire Bond ...

CxxxXR230-Sxx00-A Data Sheet

floor Price/Ceiling Price

Get Latest Price
Part Number:
CxxxXR230-Sxx00-A
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

SeekIC Buyer Protection PLUS - newly updated for 2013!

  • Escrow Protection.
  • Guaranteed refunds.
  • Secure payments.
  • Learn more >>

Month Sales

268 Transactions

Rating

evaluate  (4.8 stars)

Upload time: 2024/4/30

add to my favourite

Payment Methods

All payment methods are secure and covered by SeekIC Buyer Protection PLUS.

Notice: When you place an order, your payment is made to SeekIC and not to your seller. SeekIC only pays the seller after confirming you have received your order. We will also never share your payment details with your seller.
Product Details

Description



Features:

` XT Rectangular LED Performance
` 460 nm & 470 nm
` XR-18™ 18.0 mW min.
` XR-21™ 21.0 mW min.
` Thin 150 m Chip
` Low Forward Voltage 3.2 Typical at 20 mA
` Single Wire Bond Structure
` Class 2 ESD Rating


Application

Mobile Appliance LCD Backlighting
Digital Camera Flash


Specifications

DC Forward Current 30 mA
Peak Forward Current (1/10 duty cycle @ 1 kHz) 100 mA
LED Junction Temperature 125°C
Reverse Voltage 5 V
Operating Temperature Range -40°C to +100°C
Storage Temperature Range -40°C to +100°C
Electrostatic Discharge Threshold (HBM) Note 2 1000 V
Electrostatic Discharge Classification (MIL-STD-883E) Note 2 Class 2
Notes:
Maximum ratings are package-dependent. The above ratings were determined using a T-1 3/4 package (with Hysol OS4000
epoxy) for characterization. Ratings for other packages may differ. The forward currents (DC and Peak) are not limited by the die
but by the effect of the LED junction temperature on the package. The junction temperature limit of 125°C is a limit of the T-1
3/4 package; junction temperature should be characterized in a specific package to determine limitations. Assembly processing
temperature must not exceed 325°C (< 5 seconds). See Cree XThin® Applications Note for more assembly process information.
Product resistance to electrostatic discharge (ESD) according to the HBM is measured by simulating ESD using a rapid avalanche
energy test (RAET). The RAET procedures are designed to approximate the maximum ESD ratings shown. The RAET procedure is
performed on each die. The ESD classification of Class 2 is based on sample testing according to MIL-STD-883E.
All products conform to the listed minimum and maximum specifications for electrical and optical characteristics when assembled
and operated at 20 mA within the maximum ratings shown above. Efficiency decreases at higher currents. Typical values given
are within the range of average values expected by manufacturer in large quantities and are provided for information only. All
measurements were made using lamps in T-1 3/4 packages (with Hysol OS4000 epoxy). Optical characteristics measured in an
integrating sphere using Illuminance E.
Back contact metal is 80%/20% Au/Sn by weight, with target eutectic melting temperature of approximately 282°C. See XBright®
Applications Note for detailed packaging recommendations.
Caution: To avoid leakage currents and achieve maximum output efficiency, die attach material must not contact the side of the
chip. See Cree XThin Applications Note for more information.
Specifications are subject to change without notice.
XThin chips are shipped with the junction side down, not requiring a die transfer prior to die attach.


Description

Cree's XT Rectangular LEDs CxxxXR230-Sxx00-A are the next generation of solid-state LEDs that combine highly efficient InGaN materials with Cree's proprietary G•SiC® substrate to deliver superior price/performance for high-intensity LEDs. These LED chips have a geometrically enhanced Epi-down design to maximize light extraction efficiency and require only a single wire bond connection. These vertically structured LED chips are approximately 150 microns in height and require a low forward voltage. Cree's XT Rectangular chips CxxxXR230-Sxx00-A are tested for conformity to optical and electrical specifications and the ability to withstand 1000 V ESD. Applications for XT Rectangular LEDs include next-generation mobile appliances for use in their LCD backlights and digital camera flash where brightness, sub-miniaturization, and low power consumption are required.




Customers Who Bought This Item Also Bought

Margin,quality,low-cost products with low minimum orders. Secure your online payments with SeekIC Buyer Protection.
You may also be interested in :
Isolators
HCPL062N
HCPL316J
Line Protection, Backups
BX0023
A20B-1008-0550
Transformers
TM-09210
BV222-1-00992
Optoelectronics
SFH7770
TLP423J
Crystals and Oscillators
WT325BI0030.000000
2SB49
Test Equipment
TOP853
TOP2005
View more