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D8SB10 D8SB100

Features: Glass passivated junction chipIdeal for printed circuit boardReliable low cost construction utilizing molded plastic techniqueSurge overload rating: 175 A peak High temperature soldering guaranteed:250 oC/10sec/ 0.375 (9.5mm) lead lengthat 5 lbs tensionPinoutSpecifications RATINGS ...

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SeekIC No. : 004323510 Detail

D8SB10 D8SB100: Features: Glass passivated junction chipIdeal for printed circuit boardReliable low cost construction utilizing molded plastic techniqueSurge overload rating: 175 A peak High temperature soldering g...

D8SB10 D8SB100 Data Sheet

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Part Number:
D8SB10 D8SB100
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/29

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Product Details

Description



Features:

Glass passivated junction chip
Ideal for printed circuit board
Reliable low cost construction utilizing
molded plastic technique
Surge overload rating: 175 A peak
High temperature soldering guaranteed:
250 oC/10sec/ 0.375" (9.5mm) lead length
at 5 lbs tension


Pinout

Connection Diagram


Specifications

RATINGS SYMBOL



    D8SB     D8SB    D8SB    D8SB    D8SB    D8SB
     
    100       200        400      600      800     1000		 UNITS



Maximum Repetitive Peak Reverse Voltag VRRM
      10         20         40        60         80      100		 V
Maximum RMS Voltage VRMS
      100       200        400      600      800     1000 V
Maximum DC Blocking Voltage VDC
       70       140         280     420      560      700 A
Maximum Average Forward Rectified Current
o
Ta=70 C)

IF(AV)

8.0

 A

Peak Forward Surge Current (8.3ms single
half sine-wave superimposed on rated load)

IFSM

175

 V
Maximum Instantaneous Forward Voltage
(at forward current 4.0A DC)

VF

1.1

 A
Maximum DC Reverse Current Ta=25o C
(at rated DC blocking voltage) Ta=125o C

IR

5
500

 A

Storage and Operating Junction Temperature

TSTG,TJ

-55 to + 150

 oC



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