Features: 11 and 12 Schematics0.065 [1.65mm] height for high density packagingLow temperature coefficient (- 55°C to + 125°C) ± 100ppm/°CHot solder dipped leadsHighly stable thick filmWide resistance rangeAll devices are capable of passing the MIL-STD-202, Method 210, Condition C Resistance to ...
DFP14: Features: 11 and 12 Schematics0.065 [1.65mm] height for high density packagingLow temperature coefficient (- 55°C to + 125°C) ± 100ppm/°CHot solder dipped leadsHighly stable thick filmWide resistan...
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