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DIP20

Specifications item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue( silver glue ) 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C

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DIP20: Specifications item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue( silver glue ) 10-40 µm 0.01 W/cm°C molding comp...

DIP20 Data Sheet

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Part Number:
DIP20
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/26

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Product Details

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Specifications

item # material thickness thermal conductivity
leadframe copper 0.25 mm 2.61 W/cm°C
die attach epoxy glue( silver glue ) 10-40 µm 0.01 W/cm°C
molding compound epoxy resin 3 mm 0.0063W/cm°C



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