DescriptionThe DS8023 is available in 28-pin TSSOP and SO packages, and can often be used as a replacement for the TDA8024 with little or no application changes. The DS8023 is designed to interface between a system microcontroller and the smart card interface, providing all power supply, protectio...
DS8023: DescriptionThe DS8023 is available in 28-pin TSSOP and SO packages, and can often be used as a replacement for the TDA8024 with little or no application changes. The DS8023 is designed to interface ...
SeekIC Buyer Protection PLUS - newly updated for 2013!
268 Transactions
All payment methods are secure and covered by SeekIC Buyer Protection PLUS.
The DS8023 is available in 28-pin TSSOP and SO packages, and can often be used as a replacement for the TDA8024 with little or no application changes. The DS8023 is designed to interface between a system microcontroller and the smart card interface, providing all power supply, protection, and level shifting required for IC card applications. The DS8023 supports 5V, 3V, and 1.8V smart cards, and provides an option for ultra-low stop-mode power consumption. The DS8023 smart card interface IC is a low-cost, lowpower, analog front-end for a smart card reader designed for all ISO 7816, EMV*, and GSM11-11 applications.
The features of DS8023 can be summarized as (1)analog interface and level shifting for IC card communication; (2)8kV (min) ESD (IEC) protection on card interfaces; (3)internal IC card supply-voltage generation: 5.0V ±5%, 80mA (max), 3.0V ±8%, 65mA (max); (4)automatic card activation and deactivation controlled by dedicated internal sequencer; (5)I/O lines from host directly level shifted for smart card communication; (6)flexible card clock generation, supporting external crystal frequency divided by 1, 2, 4, or 8; (7)high-current, short-circuit and high-temperature protection.
The absolute maximum ratings of DS8023 are (1)voltage range on VDD relative to GND: -0.5V to +6.5V; (2)voltage range on VDDA relative to PGND: -0.5V to +6.5V; (3)voltage range on CP1, CP2, and VUP relative to PGND: -0.5V to +7.5V; (4)voltage range on all other pins relative to GND-0.5V to (VDD + 0.5V); (5)maximum junction temperature: +125°C; (6)maximum power dissipation (TA = -25°C to +85°C): 700mW; (7)storage temperature range: -55°C to +150°C; (8)soldering temperature: refer to the IPC/JEDEC J-STD-020.