DS8024

DescriptionThe DS8024 is a pin-for-pin drop-in replacement for the NXP TDA8024 and is offered in 28-pin TSSOP and SO packages. The DS8024 smart card interface IC is a low-cost, analog front-end for a smart card reader, designed for all ISO 7816, EMV*, and GSM11-11 applications. Applications requir...

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SeekIC No. : 004329222 Detail

DS8024: DescriptionThe DS8024 is a pin-for-pin drop-in replacement for the NXP TDA8024 and is offered in 28-pin TSSOP and SO packages. The DS8024 smart card interface IC is a low-cost, analog front-end for ...

floor Price/Ceiling Price

Part Number:
DS8024
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/26

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Product Details

Description



Description

The DS8024 is a pin-for-pin drop-in replacement for the NXP TDA8024 and is offered in 28-pin TSSOP and SO packages. The DS8024 smart card interface IC is a low-cost, analog front-end for a smart card reader, designed for all ISO 7816, EMV*, and GSM11-11 applications. Applications requiring support for 1.8V smart cards or requiring low power should consider the DS8113, which achieves lower activeand stop-mode power with minimal changes to application hardware and software.

The features of DS8024 can be summarized as (1)analog interface and level shifting for IC card communication; (2)8kV (min) ESD (IEC) protection on card interfaces; (3)internal IC card supply-voltage generation: 5.0V ±5%, 80mA (max), 3.0V ±8%, 65mA (max); (4)automatic card activation and deactivation controlled by dedicated internal sequencer; (5)I/O lines from host directly level shifted for smart card communication; (6)flexible card clock generation, supporting external crystal frequency divided by 1, 2, 4, or 8; (7)high-current, short-circuit and high-temperature protection.

The absolute maximum ratings of DS8024 are (1)voltage range on VDD relative to GND: -0.5V to +6.5V; (2)voltage range on VDDA relative to PGND: -0.5V to +6.5V; (3)voltage range on CP1, CP2, and VUP relative to PGND: -0.5V to +7.5V; (4)voltage range on all other pins relative to GND-0.5V to (VDD + 0.5V); (5)maximum junction temperature: +125°C; (6)maximum power dissipation (TA = -25°C to +85°C): 700mW; (7)storage temperature range: -55°C to +150°C; (8)soldering temperature: refer to the IPC/JEDEC J-STD-020 .




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