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DS90CF363
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MFG:TSSOP D/C:2005+

DS9 Series Datasheet download

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Part Number: DS90CF363

MFG: TSSOP

D/C: 2005+

Description: The DS90CF363 transmitter converts 21 bits of CMOS/TTL data into three LVDS (Low Voltage Differential Signaling) data s...

DS90CF363 General Description

The DS90CF363 transmitter converts 21 bits of CMOS/TTL data into three LVDS (Low Voltage Differential Signaling) data streams. A phase-locked transmit clock is transmitted in parallel with the data streams over a fourth LVDS link. Every cycle of the transmit clock 21 bits of input data are sampled and transmitted. At a transmit clock frequency of 65 MHz, 18 bits of RGB data and 3 bits of LCD timing and control data (FPLINE, FPFRAME, DRDY) are transmitted at a rate of 455 Mbps per LVDS data channel. Using a 65 MHz clock, the data throughputs is 170 Mbytes/sec.

This chipset is an ideal means to solve EMI and cable size problems associated with wide, high speed TTL interfaces.

DS90CF363 Maximum Ratings

Supply Voltage (V_CC)                                                            −0.3V to +4V
CMOS/TTL Input Voltage                                         −0.3V to (V_CC + 0.3V)
LVDS Driver Output Voltage                                    −0.3V to (V_CC + 0.3V)
LVDS Output Short Circuit Duration Continuous
Junction Temperature                                                                  +150°C
Storage Temperature                                                 −65°C to +150°C
Lead Temperature (Soldering, 4 sec)                                           +260°C
Maximum Package Power Dissipation Capacity @                            25°C
MTD48 (TSSOP) Package: DS90CF363                                            1.98 W
Package Derating: DS90CF363                          16 mW/°C above+25°C
ESD Rating (HBM, 1.5 kW, 100 pF)                                                   > 7 kV

DS90CF363 Features

·20 to 65 MHz shift clock support
·Single 3.3V supply
·Chipset (Tx + Rx) power consumption < 250 mW (typ)
·Power-down mode (< 0.5 mW total)
·Single pixel per clock XGA (1024x768) ready
·Supports VGA, SVGA, XGA and higher addressability.
·Up to 170 Megabytes/sec bandwidth
·Up to 1.3 Gbps throughput
·Narrow bus reduces cable size and cost
·290 mV swing LVDS devices for low EMI
·PLL requires no external components
·Low profile 48-lead TSSOP package
·Falling edge data strobe Transmitter
·Compatible with TIA/EIA-644 LVDS standard
·ESD rating > 7 kV
·Operating Temperature: −40°C to +85°C

DS90CF363 Connection Diagram

DS90CF363 datasheet

DS90CF363
PDF/DataSheet Download

Datasheet: DS90CF363
File Size: 189193 KB
Manufacturer: NSC [National Semiconductor]
Click here to Download

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