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Part Number: DS90CP22
Description: DS90CP22 is a 2x2 crosspoint switch utilizing LVDS (Low Voltage Differential Signaling) technology for low power, hi...
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DS90CP22
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General Description
DS90CP22 General Description
DS90CP22 is a 2x2 crosspoint switch utilizing LVDS (Low Voltage Differential Signaling) technology for low power, high speed operation. Data paths are fully differential from input to output for low noise generation and low pulse width distortion.
The non-blocking design allows connection of any input to any output or outputs. LVDS I/O enable high speed data transmission for point-to-point interconnects. This device can be used as a high speed differential crosspoint, 2:1 mux, 1:2 demux, repeater or 1:2 signal splitter. The mux and demux functions are useful for switching between primary and backup circuits in fault tolerant systems. The 1:2 signal splitter and 2:1 mux functions are useful for distribution of serial bus across several rack-mounted backplanes.
The DS90CP22 accepts LVDS signal levels, LVPECL levels directly or PECL with attenuation networks.
The individual LVDS outputs can be put into TRI-STATE by use of the enable pins.
For more details, please refer to the Application Information section of this datasheet.
DS90CP22 Maximum Ratings
Supply Voltage (VCC) −0.3V to +4V
CMOS/TTL Input Voltage (EN0, EN1, SEL0, SEL1) −0.3V to (VCC + 0.3V)
LVDS Receiver Input Voltage (IN+, IN−) −0.3V to +4V
LVDS Driver Output Voltage (OUT+, OUT−) −0.3V to +4V
LVDS Output Short Circuit Current Continuous
Junction Temperature +150°C
Storage Temperature Range −65°C to +150°C
Lead Temperature (Soldering, 4 sec.) +260°C
16L SOIC 1.435 W
16L SOIC Package Derating 11.48 mW/°C above +25°C
16L TSSOP 0.866 W
16L TSSOP Package Derating 9.6 mW/°C above +25°C
ESD Rating:
(HBM, 1.5kΩ, 100pF) > 5 kV
(EIAJ, 0Ω, 200pF) > 250 V
CMOS/TTL Input Voltage (EN0, EN1, SEL0, SEL1) −0.3V to (VCC + 0.3V)
LVDS Receiver Input Voltage (IN+, IN−) −0.3V to +4V
LVDS Driver Output Voltage (OUT+, OUT−) −0.3V to +4V
LVDS Output Short Circuit Current Continuous
Junction Temperature +150°C
Storage Temperature Range −65°C to +150°C
Lead Temperature (Soldering, 4 sec.) +260°C
16L SOIC 1.435 W
16L SOIC Package Derating 11.48 mW/°C above +25°C
16L TSSOP 0.866 W
16L TSSOP Package Derating 9.6 mW/°C above +25°C
ESD Rating:
(HBM, 1.5kΩ, 100pF) > 5 kV
(EIAJ, 0Ω, 200pF) > 250 V
DS90CP22 Features
`Low jitter 800 Mbps fully differential data path
`75 ps (typ) of pk-pk jitter with PRBS = 223−1 data pattern at 800 Mbps
`Single +3.3 V Supply
`Less than 330 mW (typ) total power dissipation
`Non-blocking "'Switch Architecture"'
`Balanced output impedance
`Output channel-to-channel skew is 35 ps (typ)
`Configurable as 2:1 mux, 1:2 demux, repeater or 1:2 signal splitter
`LVDS receiver inputs accept LVPECL signals
`Fast switch time of 1.2ns (typ)
`Fast propagation delay of 1.3ns (typ)
`Receiver input threshold < ±100 mV
`Available in 16 lead TSSOP and SOIC packages
`Inter-operates with ANSI/TIA/EIA-644-1995 LVDS standard
`Operating Temperature: −40°C to +85°C
`75 ps (typ) of pk-pk jitter with PRBS = 223−1 data pattern at 800 Mbps
`Single +3.3 V Supply
`Less than 330 mW (typ) total power dissipation
`Non-blocking "'Switch Architecture"'
`Balanced output impedance
`Output channel-to-channel skew is 35 ps (typ)
`Configurable as 2:1 mux, 1:2 demux, repeater or 1:2 signal splitter
`LVDS receiver inputs accept LVPECL signals
`Fast switch time of 1.2ns (typ)
`Fast propagation delay of 1.3ns (typ)
`Receiver input threshold < ±100 mV
`Available in 16 lead TSSOP and SOIC packages
`Inter-operates with ANSI/TIA/EIA-644-1995 LVDS standard
`Operating Temperature: −40°C to +85°C
DS90CP22 Connection Diagram
DS90CP22
PDF/DataSheet Download
- Datasheet: DS90CP22
- File Size: 358890 KB
- Manufacturer: NSC [National Semiconductor]
- Click here to Download
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