Features: ·Silicon chip on Direct-Copper-Bond substrate- High power dissipation- Isolated mounting surface- 2500V electrical isolation·For single and three phase bridge configuration·Low cathode to tab capacitance (<15pF)·Planar passivated chips·Epoxy meets UL 94V-0Specifications Symbol T...
DSP8-08AC: Features: ·Silicon chip on Direct-Copper-Bond substrate- High power dissipation- Isolated mounting surface- 2500V electrical isolation·For single and three phase bridge configuration·Low cathode to ...
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Symbol | Test Conditions | Maximum | Ratings |
IFRMS | TVJ = TVJM | 30 | A |
IFAVM | TC = 85°C; rectangular, d = 0.5 | 2 x 11 | A |
IFSM |
TVJ = 45°C; t = 10 ms (50 Hz), sine t = 8.3 ms (60 Hz), sine |
100 |
A A |
TVJ = 150°C; t = 10 ms (50 Hz), sine t = 8.3 ms (60 Hz), sine |
85 90 |
A A | |
I2t | TVJ = 45°C t = 10 ms (50 Hz), sine t = 8.3 ms (60 Hz), sine |
50 45 |
A2s A2s |
TVJ = 150°C; t = 10 ms (50 Hz), sine t = 8.3 ms (60 Hz), sine |
35 30 |
A2s A2s | |
TVJ | -40...+175 | °C | |
TVJM | 150 | °C | |
Tstg | -55...+150 | °C | |
TL | 1.6 mm (0.063 in) from case for 10 s | 260 | °C |
Ptot | TC = 25°C | 2500 | V~ |
FC | Mounting Force | 11...65 /2.5..15 | Nm/lb.in. Nm/lb.in. |
Weight | 2 |
g |