E1000-BD

Features: ·Divide-by-Four·+5.0 dBm Output Power·-30 dBc Fundamental Leakage·Single-ended or Differential Input & Output·100% On-Wafer, DC and Output Power Testing·100% Visual Inspection to MIL-STD-883 Method 2010Specifications Supply Voltage (Vcc) +7.0 VDC Supply Current (Icc) 150 mA...

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SeekIC No. : 004330505 Detail

E1000-BD: Features: ·Divide-by-Four·+5.0 dBm Output Power·-30 dBc Fundamental Leakage·Single-ended or Differential Input & Output·100% On-Wafer, DC and Output Power Testing·100% Visual Inspection to MIL-S...

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Part Number:
E1000-BD
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/28

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Product Details

Description



Features:

·Divide-by-Four
·+5.0 dBm Output Power
·-30 dBc Fundamental Leakage
·Single-ended or Differential Input & Output
·100% On-Wafer, DC and Output Power Testing
·100% Visual Inspection to MIL-STD-883 Method 2010



Specifications

Supply Voltage (Vcc) +7.0 VDC
Supply Current (Icc) 150 mA
Input Power (Pin) +15 dBm
Storage Temperature (Tstg) -65 to +165
Operating Temperature (Ta) -55 to MTTF Table1
Junction Temperature (Tch) MTTF Table1

(1) Junction temperature affects a device's MTTF. It is recommended to keep channel temperature as low as possible for maximum life.




Description

Mimix Broadband's 2.0-16.0 GHz GaAs MMIC freqency divider E1000-BD is an ECL (Emitter Coupled Logic) static frequency divider (divide-by-four) consisting of two cascaded divide-by-two circuits. Even-order harmonic levels are minimized by driving the inputs with a balanced input signal, and by taking the output differentially, but the circuit can be operated in a single-ended fashion with unused inputs & outputs open circuit. This MMIC uses Mimix Broadband's 2 um GaAs HBT device model technology to ensure high reliability and uniformity. The chip has surface passivation to protect and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This device is well suited for Millimeter-wave Point-to-Point Radio, LMDS, SATCOM and VSAT applications.




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