EE-SX1107

Series: -
Sensing Method: Transmissive
Output Configuration: Phototransistor
Current - DC Forward (If): 25mA
Current - Collector (Ic) (Max): 20mA
Voltage - Collector Emitter Breakdown (Max): 20V
Mounting Type: Surface Mount
Packaging: Cut Tape (CT)Alternate Packaging
Response Time: 10µs, 10µs
Package / Case: 4-SMD
Manufacturer: Omron Electronics Inc-EMC Div
Sensing Distance: 0.039" (1mm)


Features:

· Surface mount design, and tape and reel packaging facilitate automated PCB assembly
· Compact size makes these sensors ideal for use in applications with restricted space
·High-resolution sensing with phototransistor output
·Dual channel model that is ideal for encoder applications (EE-SX1131)


Specifications

Item		Symbol	Rated value
Emitter	Forward current	IF	25 mA (see note)
	Pulse forward current	IFP	100 mA (duty: 1/100, pulse width: 0.1 ms)
	Reverse voltage	VR	5 V
Receiver	Collector-emitter voltage	VCEO	20V
	Emitter-collector voltage	VECO	5 V
	Collector current	IC	20 mA
	Collector dissipation	PC	75 mW (see note)
Ambient temperature	Operating	Topr	-30° to 85°C
	Storage	Tstg	-40° to 90°C
	Soldering	Tsol	240°C (10 second max)

Note: Refer to Engineering Data if the ambient temperature is not within the normal room temperature range.

Parameters:

Technical/Catalog Information	EE-SX1107
Vendor	Omron Electronics Inc-ECB Div (VA)
Category	Sensors, Transducers
Sensing Distance	0.039" (1mm)
Sensing Method	Transmissive
Voltage - Collector Emitter Breakdown (Max)	20V
Current - Collector (Ic) (Max)	20mA
Current - DC Forward (If)	25mA
Output Configuration	Phototransistor
Response Time	10s , 10s <!--10us-->
Type	Unamplified
Mounting Type	Surface Mount
Package / Case	4-SMD
Packaging	Cut Tape (CT)
Operating Temperature	-30°C ~ 85°C
Lead Free Status	Lead Free
RoHS Status	RoHS Compliant
Other Names	EE SX1107 EESX1107 OR636CT ND OR636CTND OR636CT