ES1PA

Features: * Very low profile - typical height of 1.0mm* For surface mount application* Glass passivated chip junction* Ultrafast recovery times for high efficiency* Low forward voltage, low power loss* Built in strain relief, ideal for automated placement* High temperature soldering:260°C maximum/...

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ES1PA Picture
SeekIC No. : 004338120 Detail

ES1PA: Features: * Very low profile - typical height of 1.0mm* For surface mount application* Glass passivated chip junction* Ultrafast recovery times for high efficiency* Low forward voltage, low power lo...

floor Price/Ceiling Price

Part Number:
ES1PA
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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268 Transactions

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evaluate  (4.8 stars)

Upload time: 2024/4/30

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Product Details

Description



Features:

* Very low profile - typical height of 1.0mm
* For surface mount application
* Glass passivated chip junction
* Ultrafast recovery times for high efficiency
* Low forward voltage, low power loss
* Built in strain relief, ideal for automated placement
* High temperature soldering:260°C maximum/10 seconds at terminals
* Meets MSL level 1 per J-STD-020C



Specifications

Parameter

Symbol

ES1PA

ES1PB

ES1PC

ES1PD

Unit

Device marking code

 

EA

EB

EC

ED

 

Maximum reverse voltage

VRM

50

100

150

200

V

Maximum average forward rectified current see Fig.1

IF(AV)

1.0

A

Peak forward surge current 10ms single half sine-wave
superimposed on rated load

IFSM

30

A

Typical thermal resistance(1)

RJA
RJL
RJC

105
15
20

/W

Operating junction and Storage temperature range

TJ, TSTG

55 to +150




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