FAN1539

Notes:
3. Junction to ambient thermal resistance, JA, is a strong function of PCB material, board thickness, thickness andnumber ofcopper plains, number of via used, diameter of via used, available copper surface, and attached heat sinkcharacteristics.Thermal resistance(JA ), V_IN, I_OUT must be chosen not to exceed T_J = 150°C.
4. Soldering temperature should be 260°C for 10 second after 240°C for 30 second in I.R. reflow using 60/40solder. Maximumrate of temperature rise is 3°C/SEC to within 100°C of the final temperature.
5. Using Mil Std. 883E, method 3015.7(Human Body Model) and EIA/JESD22C101-A (Charge Device Model).

The FAN1539/FAN1540 series of high current LDO (1.0A and 1.3A) has been developed for portable applications where low quiescent current is an important requirement. The device features excellent line and load transient response which does not exceed 10% of nominal output value for full operating temperature range even during power ON cycle and short circuit removal. Internally trimmed, temperature compensated bandgap reference guarantees 2.5% accuracy for full range of input voltage, output current and temperature. Included on the chip are accurate current limit and thermal shutdown protection. Device stability is achieved with only two external low ESR ceramic capacitors.

The FAN1539/FAN1540 is available in thermally enhanced 3x3mm 6-lead MLP, 5x6mm 8-lead MLP package and 3-lead TO-252 packages. The 5x6mm MLP package version features separate Kelvin sense pin for high precision applications.