FDZ7064S

MOSFET 30V/12V NCh SYNCFET

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SeekIC No. : 00165817 Detail

FDZ7064S: MOSFET 30V/12V NCh SYNCFET

floor Price/Ceiling Price

Part Number:
FDZ7064S
Mfg:
Fairchild Semiconductor
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/26

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Product Details

Quick Details

Transistor Polarity : N-Channel Drain-Source Breakdown Voltage : 30 V
Gate-Source Breakdown Voltage : +/- 16 V Continuous Drain Current : 13.5 A
Resistance Drain-Source RDS (on) : 0.0072 Ohms Configuration : Single
Maximum Operating Temperature : + 150 C Mounting Style : SMD/SMT
Package / Case : BGA-30 Packaging : Reel    

Description

Transistor Polarity : N-Channel
Configuration : Single
Mounting Style : SMD/SMT
Packaging : Reel
Drain-Source Breakdown Voltage : 30 V
Maximum Operating Temperature : + 150 C
Continuous Drain Current : 13.5 A
Gate-Source Breakdown Voltage : +/- 16 V
Package / Case : BGA-30
Resistance Drain-Source RDS (on) : 0.0072 Ohms


Features:

13.5 A, 30 V.  RDS(ON) = 7 m @ VGS = 10 V
                         RDS(ON) = 9 m @ VGS = 4.5 V
Occupies only 14 mm2  of PCB area.  Only 42% of the area of SO-8
Ultra-thin package:  less than 0.8 mm height when mounted to PCB
3.5 x 4 mm2  Footprint
High power and current handling capability.



Application

DC/DC converters


Pinout

  Connection Diagram


Specifications

Symbol Parameter Ratings Units
VDSS Drain-Source Voltage 30 V
VGSS Gate-Source Voltage ±16 V
ID Drain Current Continuous (Note 1a) Pulsed 13.5 A
  60
PD Power Dissipation (Steady State) (Note 1a) 2.2 W
TJ, Tstg Operating and Storage Junction Temperature Range 55 to +150  



Description

This MOSFET is designed to replace a single MOSFET and parallel Schottky diode in synchronous DC:DC power supplies.  Combining  Fairchild's  30V  PowerTrenchSyncFET process with state of the art BGA packaging, the FDZ7064S minimizes both PCB space and RDS(ON).  This BGA SyncFET embodies a breakthrough in both packaging and power MOSFET integration which enables the device to combine excellent thermal transfer characteristics, high current handling capability, ultra-low profile packaging, low
gate  charge,  ultra-low  reverse  recovery  charge  and  low RDS(ON).


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