Features: • 9.3A, 80V, RDS(on) = 0.21Ω @VGS = 10 V• Low gate charge ( typical 5.9 nC)• Low Crss ( typical 13 pF)• Fast switching• 100% avalanche tested• Improved dv/dt capabilitySpecifications Symbol Parameter FQT7N10 Units VDSS Drain-Source V...
FQD9N08: Features: • 9.3A, 80V, RDS(on) = 0.21Ω @VGS = 10 V• Low gate charge ( typical 5.9 nC)• Low Crss ( typical 13 pF)• Fast switching• 100% avalanche tested• Imp...
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| Symbol | Parameter | FQT7N10 |
Units |
| VDSS | Drain-Source Voltage(Note 2) | 80 | V |
| ID | Drain Current - Continuous (TC = 25°C) - Continuous (TC = 70°C) |
7.4 | A |
| 4.68 | A | ||
| IDM | Drain Current - Pulsed (Note 1) | 29.6 | A |
| VGSS | Gate-Source Voltage | ± 25 | V |
| EAS | Single Pulsed Avalanche Energy | 55 | mJ |
| IAR | Avalanche Current (Note 1) | 7.4 | A |
| EAR | Repetitive Avalanche Energy (Note 1) | 2.5 | mJ |
| dv/dt | Peak Diode Recovery dv/dt (Note 3) | 6.5 | V/ns |
| PD | Power Dissipation (TC = 25°C) | 2.5 | W |
| Power Dissipation (TC = 25°C) - Derate above 25°C | 25 | W | |
| 0.2 | W/°C | ||
| TJ, TSTG | Operating and Storage Temperature Range |
-55 to +150 | °C |
| TL | Maximum lead temperature for soldering purposes, 1/8" from case for 5 seconds |
300 | °C |