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FSF9250D

Features: • 15A, -200V, rDS(ON) = 0.290• Total Dose - Meets Pre-RAD Specifications to 100K RAD (Si)• Single Event - Safe Operating Area Curve for Single Event Effects - SEE Immunity for LET of 36MeV/mg/cm2 with VDS up to 80% of Rated Breakdown and VGS of 10V Off-Bias• Dose ...

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FSF9250D: Features: • 15A, -200V, rDS(ON) = 0.290• Total Dose - Meets Pre-RAD Specifications to 100K RAD (Si)• Single Event - Safe Operating Area Curve for Single Event Effects - SEE Immunit...

FSF9250D Data Sheet

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Part Number:
FSF9250D
Supply Ability:
5000

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  • 1~5000
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Product Details

Description



Features:

• 15A, -200V, rDS(ON) = 0.290
• Total Dose
   - Meets Pre-RAD Specifications to 100K RAD (Si)
• Single Event
   - Safe Operating Area Curve for Single Event Effects
   - SEE Immunity for LET of 36MeV/mg/cm2 with VDS up to 80% of Rated Breakdown and VGS of 10V Off-Bias
• Dose Rate
   - Typically Survives 3E9 RAD (Si)/s at 80% BVDSS
   - Typically Survives 2E12 if Current Limited to IDM
• Photo Current
   - 12nA Per-RAD(Si)/s Typically
• Neutron
   - Maintain Pre-RAD Specifications for 1E13 Neutrons/cm2
   - Usable to 1E14 Neutrons/cm2


Specifications

    FSF9250D, FSF9250R UNITS
Drain-Source Voltage VDS
-200
V
Drain-Gate Voltage (RGS = 20k). VDGR
-200
V
Continuous Drain Current
TC = 25
TC = 100
ID
ID

15
9
A
A
Pulsed Drain Current IDM
45
A
Gate-Source Voltage VGS
±20
V
Maximum Power Dissipation
TC = 25
TC = 100		 PT
PT
125
50
W
W
Linear Derating Factor  
1.00
W/
Single Pulsed Avalanche Current,L = 100H, (See Test Figure) IAS
45
A
Continuous Source Current (Body Diode) IS
15
A
Pulsed Source Current (Body Diode) ISM
45
A
Operating And Storage Temperature TJ, TSTG
-55 to +150
Lead Temperature (During Soldering)
Distance > 0.063 in. (1.6mm) From Case, 10s Max		 TL
300
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operationof the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.


Description

The Discrete Products Operation of Intersil Corporation FSF9250D has developed a series of Radiation Hardened MOSFETs specifically designed for commercial and military space applications. Enhanced Power MOSFET immunity to Single Event Effects (SEE), Single Event Gate Rupture (SEGR) in particular, is combined with 100K RADS of total dose hardness to provide devices, FSF9250D is ideally suited to harsh space environments.

The dose rate and neutron tolerance necessary FSF9250D for military applications have not been sacrificed. The Intersil portfolio of SEGR resistant radiation hardened MOSFETs includes N-Channel and P-Channel devices in a variety of voltage, current and on-resistance ratings. Numerous packaging options are also available.

This MOSFET FSF9250D is an enhancement-mode silicon-gate power field-effect transistor of the vertical DMOS (VDMOS) structure.FSF9250D is specially designed and processed to be radiationtolerant. The MOSFET is well suited for applications exposed to radiation environments such as switching regulation, switching converters, motor drives, relay drivers and drivers for high-power bipolar switching transistors requiring high speed and low gate drive power. FSF9250D can be operated directly from integrated circuits.

Reliability screening FSF9250D is available as either commercial, TXV equivalent of MIL-S-19500, or Space equivalent of MIL-S-19500. Contact Intersil for any desired deviations from the data sheet.




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