Features: •Ultra-thin,thickness (5×3.2×1.2mm).•It is a compact and thin ceramic package with a matalized lead for surface mounting that is able to be automatically loaded.•Reflow soldering is possible.•CMOS, TTL IC direct drive is possible. Depending upon the frequency band...
FXO-62F: Features: •Ultra-thin,thickness (5×3.2×1.2mm).•It is a compact and thin ceramic package with a matalized lead for surface mounting that is able to be automatically loaded.•Reflow s...
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