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GFB75N03

Features: • Advanced Trench Process Technology• High Density Cell Design for Ultra Low On-Resistance• Specially Designed for Low Voltage DC/DC Converters• Fast Switching for High Efficiency• High temperature soldering in accordance with CECC802/Reflow guaranteedSpecif...

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SeekIC No. : 004353346 Detail

GFB75N03: Features: • Advanced Trench Process Technology• High Density Cell Design for Ultra Low On-Resistance• Specially Designed for Low Voltage DC/DC Converters• Fast Switching for ...

GFB75N03 Data Sheet

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Part Number:
GFB75N03
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/27

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Product Details

Description



Features:

• Advanced Trench Process Technology
• High Density Cell Design for Ultra Low On-Resistance
• Specially Designed for Low Voltage DC/DC Converters
• Fast Switching for High Efficiency
• High temperature soldering in accordance with CECC802/Reflow guaranteed


Specifications

Parameter
Symbol
Limit
Unit
Drain-Source Voltage
VDS
30
V
Gate-Source Voltage
VGS
±20
Continuous Drain Current(1)
ID
75
A
Pulsed Drain Current
IDM
240
Maximum Power Dissipation TA = 25°C
PD
62.5
W
TA = 100°C
25
Operating Junction and Storage Temperature Range
TJ,Tstg
-55to150
°C
Lead Temperature (1/8" from case for 5 sec.)
TL
275
°C
Junction-to-Case Thermal Resistance
RJC
2.0
°C/W
Junction-to-Ambient Thermal Resistance (PCB Mounted)
RJA
62.5
°C/W
Note: (1) Maximum DC current limited by the package


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