Purchase GP210, In-stock GP210 From SeekIC.
- Table of contents:
GP210
-
Suppliers
DataSheet
General Description
GP210 Maximum Ratings
| PARAMETER (TEST CONDITIONS) | SYMBOL |
RATINGS |
UNITS | ||||||
| Parameter | GP200 | GP201 | GP202 | GP204 |
GP206 |
GP208 |
GP210 | ||
| Maximum DC Blocking Voltage |
VRM |
50 |
100 |
200 |
400 |
600 |
800 |
1000 |
VOLTS |
| Maximum RMS voltage |
VRMS |
35 |
70 |
140 |
280 |
420 |
560 |
700 | |
| Maximum Peak Reverse Voltage |
VRRM |
50 |
100 |
200 |
400 |
600 |
800 |
1000 | |
| Average Forward Rectified Current @TA =75 Lead Iength=0.375in(9.5mm) |
IC |
2 |
AMPS
| ||||||
| Peak forward surge current (8.3ms single half sinewave superimposed on rated load) |
IFSM |
70 | |||||||
| Maximum forward Voltage at 2A mps DC |
VFM |
1.1 |
VOLTS | ||||||
| Maximum Reverse Recovery Time(IF=0.5A.IR=1A,IRR=0.25A) |
TRR |
30 |
|||||||
| Maximum DC reverse current @TA=25 at rated DC blocking voltage @TA =125 |
IRM |
5 50 |
uA | ||||||
| Typical junction capacitance (Note 1) |
CJ |
40 |
pF | ||||||
| Operating and Storage Temperature Range |
Tj,TSTG |
65 to +150 |
| ||||||
GP210 Features
PROPRIETARY SOFT GLASS ®JUNCTION
PASSIVATION FOR SUPERIOR RELIABILITY AND
PERFORMANCE
VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM
MECHANICAL STRENGTH AND HEAT DISSIPATION
(Solder Voids: Typical < 2%, Max. < 10% of Die Area
EXTREMELY LOW LEAKAGE AT HIGH TEMPERATURES
LOW FORWARD VOLTAGE DROP
1A at T° = 75 ° C WITH NO THERMAL RUNAWAY
PASSIVATION FOR SUPERIOR RELIABILITY AND
PERFORMANCE
VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM
MECHANICAL STRENGTH AND HEAT DISSIPATION
(Solder Voids: Typical < 2%, Max. < 10% of Die Area
EXTREMELY LOW LEAKAGE AT HIGH TEMPERATURES
LOW FORWARD VOLTAGE DROP
1A at T° = 75 ° C WITH NO THERMAL RUNAWAY
GP2101-7R
PDF/DataSheet Download
- Datasheet: GP2101-7R
- File Size: 74090 KB
- Manufacturer: POWER-ONE [Power-One]
- Click here to Download
- ·GP2001-7R
- POWER-ONE [Power-One]
- 120...195 Watt DC-DC Converters
- 74090 KB
- ·GP200MHS12
- DYNEX [Dynex Semiconductor]
- Half Bridge IGBT Module
- 101941 KB
- ·GP200MHS18
- DYNEX [Dynex Semiconductor]
- Half Bridge IGBT Module
- 138957 KB
- ·GP200MKS12
- DYNEX [Dynex Semiconductor]
- IGBT Chopper Module Preliminary Information
- 129685 KB
- ·GP200MLS12
- DYNEX [Dynex Semiconductor]
- IGBT Chopper Module Preliminary Information
- 130171 KB
- ·GP2010
- MITEL [Mitel Networks Corporation]
- GPS Receiver RF Front End
- 154755 KB
- ·GP2015
- MITEL [Mitel Networks Corporation]
- GPS Receiver RF Front End
- 158435 KB
- ·GP201MHS18
- DYNEX [Dynex Semiconductor]
- Low VCE(SAT) Half Bridge IGBT Module
- 132361 KB
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