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GP402
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Suppliers
DataSheet
General Description
GP402 Maximum Ratings
| PARAMETER (TEST CONDITIONS) | SYMBOL |
RATINGS |
UNITS | ||||||
| Series Number | GP400 | GP401 | GP402 | GP404 | GP406 | GP408 | GP410 | ||
| Maximum DC Blocking Voltage | VRM | 50 | 100 | 200 | 400 | 600 | 800 | 1000 | VOLTS |
| Maximum RMS Voltage | VRMS | 35 | 70 | 140 | 280 | 420 | 560 | 700 | |
| Maximum Peak Recurrent Reverse Voltage | VRRM | 50 | 100 | 200 | 400 | 600 | 800 | 1000 | |
| Average Forward Rectified Current @ T = 75 , Lead length = 0.375 in. (9.5 mm) | IO |
4. |
AMPS | ||||||
| Peak Forward Surge Current (8.3ms Single Half Sine Wave Superimposed on Rated Load) |
IFSM |
200 | |||||||
| Maximum Forward Voltage at 4 A Peak DC | VFM |
1 |
VOLTS | ||||||
| Maximum Full Cycle Reverse Current @ TL = 75 (Note 1) | IRM(AV) |
20 |
A | ||||||
| Maximum Average DC Reverse Current @ TA = 25 At Rated DC Blocking Voltage @ TA = 100 |
IRM |
2 50 | |||||||
| Typical Thermal Resistance, Junction to Ambient (Note 1) | RJA |
18 |
/W | ||||||
| Typical Junction Capacitance (Note 2) | CJ |
70 |
pF | ||||||
| Operating and Storage Temperature Range | TJ,TSTG |
-65 to +175 |
|||||||
GP402 Features
·PROPRIETARY SOFT GLASS® JUNCTION PASSIVATION FOR SUPERIOR RELIABILITY AND PERFORMANCE
·VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area)
·EXTREMELY LOW LEAKAGE AT HIGH TEMPERATURES
·LOW FORWARD VOLTAGE DROP
·4A at TA = 75 C WITH NO THERMAL RUNAWAY
·VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area)
·EXTREMELY LOW LEAKAGE AT HIGH TEMPERATURES
·LOW FORWARD VOLTAGE DROP
·4A at TA = 75 C WITH NO THERMAL RUNAWAY
GP4020
PDF/DataSheet Download
- Datasheet: GP4020
- File Size: 212221 KB
- Manufacturer: ZARLINK [Zarlink Semiconductor Inc]
- Click here to Download
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