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Part Number: GS881E32

 

 

 

 

Description: This supplemental information applies to the GS881E18/36AT datasheet, which you will find attached to ...


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GS881E32 General Description


This supplemental information applies to the GS881E18/36AT datasheet, which you will find attached to this document. This supplement includes a new package offering (the 165-bump BGA-Package D), as well as an additional organization (x32, which is only offered in the 165 BGA for this part).

GS881E32 Maximum Ratings

Symbol Description Value Unit
VDD Voltage on VDD Pins 0.5 to 4.6 V
VDDQ Voltage in VDDQ Pins 0.5 to 4.6 V
VI/O Voltage on I/O Pins 0.5 to VDDQ +0.5 ( 4.6 V max.) V
VIN Voltage on Other Input Pins 0.5 to VDD +0.5 ( 4.6 V max.) V
IIN Input Current on Any Pin +/20 mA
IOUT Output Current on Any I/O Pin +/20 mA
PD Package Power Dissipation 1.5 W
TSTG Storage Temperature 55 to 125
TBIAS Temperature Under Bias 55 to 125

Note:
Permanent damage to the device may occur if the Absolute Maximum Ratings are exceeded. Operation should be restricted to Recommended Operating Conditions. Exposure to conditions exceeding the Absolute Maximum Ratings, for an extended period of time, may affect reliability of this component.

GS881E32 datasheet

GS809C
PDF/DataSheet Download

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    This supplemental information applies to the GS881E18/36AT datasheet, which you will find attached to this document. GS881E18/36AT includes a new package offering (the 165-bump BGA-Package D), as well as an additional organization (x32, which is only offered...

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