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HB56SW464DBJ

Features: ` 144-pin Zig Zag Dual tabs socket type -Lead pitch: 0.80 mm` Single 3.3 V (+0.3, 0.15 V) supply` High speed -Access time: tRAC = 60 ns (max) tCAC = 15 ns (max)` Low power dissipation -Active mode: 3.024 W (max) -Standby mode (TTL): 115 mW (max) (CMOS): 58 mW (max) (CMOS): 8.64 mW (max) ...

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SeekIC No. : 004358959 Detail

HB56SW464DBJ: Features: ` 144-pin Zig Zag Dual tabs socket type -Lead pitch: 0.80 mm` Single 3.3 V (+0.3, 0.15 V) supply` High speed -Access time: tRAC = 60 ns (max) tCAC = 15 ns (max)` Low power dissipation -Act...

HB56SW464DBJ Data Sheet

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Part Number:
HB56SW464DBJ
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

`  144-pin Zig Zag Dual tabs socket type
     - Lead pitch: 0.80 mm
`  Single 3.3 V (+0.3, 0.15 V) supply
`  High speed
     - Access time: tRAC = 60 ns (max)
     tCAC = 15 ns (max)
`  Low power dissipation
     - Active mode: 3.024 W (max)
     - Standby mode (TTL): 115 mW (max)
     (CMOS): 58 mW (max)
     (CMOS): 8.64 mW (max) (L/LS-version)
`  EDO mode capability
`  Refresh period
    - 2048 refresh cycles: 32 ms
    128 ms (L/LS-version)
`  3 variat ions of refresh
     -  RAS -only refresh
     - CAS -before-RAS refresh
     - Self refresh (LS-version)


Specifications

Parameter
Symbol
Value
Unit
Voltage on any pin relative to VSS
VT
0.5 to +4.6
V
Supply voltage relative to VSS
VCC
-0.5 to +4.6
V
Short circuit output current
Iout
50
mA
Power dissipation
PT
16
W
Operating temperature
Topr
0 to +70
°C
Storage temperature
Tstg
55 to +125
°C



Description

The HB56SW464DBJ is a 4M×64 dynamic RAM Small Outline Dual In-line Memory Module (S.O.DIMM), mounted 16 pieces of 16-Mbit DRAM (HM51W17805) sealed in TCP package and 1 piece of serial EEPROM (24C02) for Presence Detect (PD). The HB56SW464DBJ offers Extended Data Out (EDO) Page Mode as a high speed access mode. An outline of the HB56SW464DBJ is 144-pin Zig Zag Dual tabs socket type compact and thin package. Therefore, the B56SW464DBJ makes high density mounting possible without surface mount technology. It provides common data inputs and outputs. Decoupling capacitors are mounted beside each TCP on the module board.




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