Purchase HBYD57M, In-stock HBYD57M From SeekIC.
Part Number: HBYD57M
Description: Cavity free cylindrical glass SOD87 package through Implotec(TM)(1) technology. The SOD87 is
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HBYD57M
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DataSheet
General Description
HBYD57M General Description
Cavity free cylindrical glass SOD87 package through Implotec(TM)(1) technology. The SOD87 is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
HBYD57M Maximum Ratings
| SYMBOL | PARAMETER | CONDITIONS | MIN. | MAX. | UNIT |
| VRRM | repetitive peak reverse voltage | 1000 | V | ||
| VR | crest working reverse voltage | 1000 | V | ||
| I F(AV) | average forward current | Ttp =55 °C; lead length = 10 mm; see Figs 2; 3 and 4 averaged over any 20 ms period; see also Figs 14; 15 and 16 |
1.0 | A | |
| I F(AV) | average forward current | Tamb =65 °C; PCB mounting (see Fig.25); see Figs 5; 6 and 7 averaged over any 20 ms period; see also Figs 14; 15 and 16 |
0.4 | A | |
| IFRM | repetitive peak forward current | Ttp =65 °C; see Fig.6 | 8.5 | A | |
| IFRM | repetitive peak forward current | Tamb =60 °C; see Fig.7 | 3.0 | A | |
| IFSM | non-repetitive peak forward current | t = 10 ms half sine wave; Tj =Tj max prior to surge; VR =VRRMmax |
5.0 | A | |
| ERSM | non-repetitive peak reverse avalanche energy |
L = 120 mH; Tj =Tj max prior to surge; inductive load switched off |
10 | mJ |
| Tstg | storage temperature | -65 | +175 | ||
| Tj | operating junction temperature | see Figs 17 and 18 | -65 | 175 |
HBYD57M Features
* Glass passivated
* High maximum operating temperature
* Low leakage current
* Excellent stability
* Guaranteed avalanche energy absorption capability
* Shipped in 8 mm embossed tape
* Smallest surface mount rectifier outline.
* High maximum operating temperature
* Low leakage current
* Excellent stability
* Guaranteed avalanche energy absorption capability
* Shipped in 8 mm embossed tape
* Smallest surface mount rectifier outline.
HBYD57M Connection Diagram
- Datasheet:
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- · EPCS4SI8
- 226669 KB
- · UTC2411
- 136508 KB
- ·(M5M410092B)
- Mitsubishi
- 3D-RAM
- 1268750 KB
- ·_FCQ30A06
- NIEC [Nihon Inter Electronics Corporation]
- LOW FORWARD VOLTAGE DROP
- 29515 KB
- ·0001.2501.PT
- Fuse
- 40400 KB
- ·0001.2501.TR
- Fuse
- 40400 KB
- ·0001.2502.PT
- Fuse
- 40400 KB
- ·0001.2502.TR
- Fuse
- 40400 KB
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