HCPL-0630

Current Transfer Ratio :
Maximum Input Diode Current :
Maximum Reverse Diode Voltage : 5 V
Minimum Operating Temperature : - 40 C
Packaging : Tube
Package / Case : SOIC-8
Maximum Operating Temperature : + 85 C
Maximum Baud Rate : 10 MBps
Maximum Forward Diode Voltage : 1.75 V
Maximum Power Dissipation : 60 mW


Features:

• Available in 8 Pin DIP and SOIC-8
• Internal Shield for High Common Mode Rejection (CMR)
HCPL-2631/0631: 10,000 V/ms @ VCM = 50 V
HCPL-4661/0661: 15,000 V/ms @ VCM = 1000 V
• High Density Packaging
• Low Input Current Capability: 5 mA
• High Speed: 10 MBd
• LSTTL and TTL Compatible
• Guaranteed AC and DC Performance Over Temperature: -40°C to 85°C
• Recognized Under the Component Program of UL1577 (File No. E55361) for Dielectric Withstand Proof Test Voltages of 2500 Vrms, 1 Minute
• 5000 Vrms, 1 Minute (Option 020) (HCPL-2630/ 2631/4661)
• CSA Approved Under Component Acceptance Notice No. 5 (File No. CA 88324) (HCPL-2630/2631/ 4661)
• Hermetic Equivalent Device Available (HCPL- 5630/31)
• Surface Mount Gull Wing Option Available for 8 Pin DIP (Option 300)




Application

• Isolation of High Speed Logic Systems
• Microprocessor System Interfaces
• Isolated Line Receiver
• Computer-Peripheral Interfaces
• Ground Loop Elimination
• Digital Isolation for A/D, D/A Conversion
• Power Transistor Isolation in Motor Drives




Specifications

Storage Temperature ............................................ -55°C to +125°C
Operating Temperature ........................................... -40°C to +85°C
Lead Solder Temperature (8 Pin DIP) .......................... 260°C for 10 s
(1.6 mm below seating plane)
Average Forward Input Current
(each channel, See note 2) ..................................................... 15 mA
Reverse Input Voltage (each channel) .......................................... 5 V
Supply Voltage VCC (1 Minute Maximum) ................................ 7 V
Output Collector Current IO (each channel) ......................... 50 mA
Output Collector Voltage VO (each channel)** ......................... 7 V
Output Collector Power Dissipation (each channel) ........... 60 mW[17]
Infrared and Vapor Phase Reflow
Temperature (SOIC-8 & Option #300) ................. See Thermal Profile




Description

These HCPL-0630 dual channel devices are optically coupled logic gates that combine GaAsP light emitting diodes and integrated high gain photodetectors. The photons are collected in the detector by a photodiode and the current is amplified by a high gain linear amplifier that drives a Schottky clamped open collector output transistor. Each circuit is temperature, current and voltage compensated. Theinternal shield provides a guaranteed common mode transient immunity specification of 5000 V/ms for the HCPL- 2631/0631, and 10,000 V/ms for the HCPL-4661/0661.

These HCPL-0630 dual channel optocouplers are available in an 8 Pin DIP and in an industry standard SOIC-8 package. The following is a cross reference table listing the 8 Pin DIP part number and the electrically equivalent SOIC-8 part number.

Parameters:

Technical/Catalog Information	HCPL-0630
Vendor	Avago Technologies US Inc.
Category	Isolators
Mounting Type	Surface Mount
Package / Case	8-SOIC (3.9mm Width)
Isolation Voltage	3750Vrms
Configuration	2, One Direction
Input Type	DC
Output Type	Open Collector
Data Rate	10Mbs
Current - Output/Channel	50mA
Packaging	Tube
Lead Free Status	Contains Lead
RoHS Status	RoHS Non-Compliant
Other Names	HCPL 0630 HCPL0630 516 1088 5 ND 51610885ND 516-1088-5