HCPL-6631

Current Transfer Ratio :
Maximum Input Diode Current :
Packaging :
Maximum Reverse Diode Voltage : 5 V
Maximum Forward Diode Voltage : 1.9 V
Minimum Operating Temperature : - 55 C
Maximum Baud Rate : 10 MBps
Maximum Operating Temperature : + 125 C
Maximum Power Dissipation : 200 mW
Package / Case : LCCC-20


Description

The HCPL-6631 is a high reliability Class H two channel hermetically sealed optocoupler in a 20 Pad Leadless Ceramic Chip Carrier package with solder dipped pads. The solder contains lead.
The HCPL-6631 is capable of operation and storage over the full military temperature range and may also be purchased as either commercial grade, with full MIL-PRF-38534 Class K testing or from the appropriate DSCC SMD (81028 for the Class H, 5962-98001 for the Class K). The HCPL-6631 is manufactured and tested on a MIL-PRF-38534 certified line and is included in the DSCC Qualified Manufacturers List QML-38534 for Hybrid Microcircuits. Quad channel devices are available by special order in the 16-Pin DIP through-hole packages.
Each HCPL-6631 channel contains a GaAsP light emitting diode which is optically coupled to an integrated high speed photon detector. The output of the detector is an open collector Schottky clamped transistor. Internal shields provide a guaranteed common mode transient immunity specification of 1000 V/micro-second. For Isolation Voltage applications requiring up to 2500 Vdc, the HCPL-5650 family is also available. Package styles for this die set in one, two, or four channels are 8 and 16-Pin DIP through hole, 16-Pin surface mount DIP flat pack, and 20 pad Leadless Ceramic Chip Carrier. Most devices may be purchased with a variety of lead forms and plating options. See the datasheet for details.
Because the same electrical die (emitters and detectors) are used for each HCPL-6631 channel of each device listed in the datasheet, absolute maximum ratings, recommended operating conditions, electrical specifications, and performance characteristics shown in the datasheet figures are virtually identical for all parts. Occasional exceptions exist due to package variations and limitations and are as noted. Additionally, the same package assembly processes and materials are used in all devices. These similarities give justification for the use of data obtained from one part to represent other parts performance for reliability and certain limited radiation test results.