THERM PAD TO-218 W/ADH HI-FLOW
HF115AC-0.0055-AC-90: THERM PAD TO-218 W/ADH HI-FLOW
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| Series: | Hi-Flow® 115-AC | Manufacturer: | Bergquist | ||
| Usage: | TO-218, TO-220, TO-247 | Shape: | Rectangular | ||
| Outline: | 21.84mm x 18.79mm | Thickness: | 0.0055" (0.140mm) | ||
| Propagation Delay Time : | 35 ns | Material: | Phase Change Compound | ||
| Adhesive: | Adhesive - One Side | Backing, Carrier: | Fiberglass | ||
| Color: | Gray | Thermal Resistivity: | 0.35°C/W |