HEATPAD TO-220 W/ADH HI-FLOW
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| Technical/Catalog Information | HF115TAAC-58 |
| Vendor | Bergquist |
| Category | Thermal Management |
| Usage | TO-220 |
| Shape | Rectangular |
| Material | Fiberglass |
| Thermal Conductivity | 0.8 W/m-K |
| Thermal Resistivity | 0.2°C/W |
| Thickness | 0.005" (0.127mm) |
| Outline | 19.05mm x 12.70mm |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | HF115TAAC 58 HF115TAAC58 BER168 ND BER168ND BER168 |